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Embossing device with positioning accuracy in the sub-micrometre range

Embossing device with positioning accuracy in the sub-micrometre range

The goal of the Cluster of Excellence PhoenixD, a large interdisciplinary initiative, is the time- and cost-efficient production of optical systems. One promising approach is the precise moulding of micro- and nanostructures in a precisely controllable embossing process. Embossing as a manufacturing process for structured functional surfaces enables high output rates at low costs per component.

However, the embossing of micro- and nanostructures in particular places high demands on the precision of the machines and dies used as well as on the accuracy of the positioning of active parts. Machine and die-related disturbances are often unavoidable - these include guide inaccuracies, bearing play or temperature-related expansions. All these effects can be counteracted by active process control. Within the framework of the Cluster of Excellence, the aim is to develop an embossing device that makes it possible to transfer micro- and nanostructures reproducibly and in high quality.

In a first test setup of an embossing device developed at the IFUM, a vertical positioning accuracy in the range of 100 nm could already be achieved. Thus, the first lattice structures with a lattice spacing of 10 µm could be successfully transferred into a plastic film.

In the further course of the project, the positioning accuracy is to be further increased in order to be able to transfer optical structures in the nanometre range, such as Bragg gratings.